DIYPHONE Universal BGA Reballing Stencil Kit, 19-Piece

Brand: DIYPHONE

Model: Universal BGA Reballing Stencil Kit

Color: silvery

Features

• 【Planting Tin Steel Mesh 】BGA Reballing Stencil Design For Xiaomi Series Phone CPU IC Chip Repair ,0.12mm thickness.BGA stencil is versatile and suitable for the common IC used in cell phones today, which can meet your various needs.
• 【BGA Reballing Stencil Material】The tin mesh solder template is made of premium stainless steel material, which is not easily damaged and good durability for long use.Crafted for durability, this stencil withstands high temperatures, ensuring reliable BGA reballing.
• 【Template Mesh Directly Heat】Template Mesh Directly Heat Multi-purpose BGA Reballing Stencils Make your repair work easier.these stencils are not easy to deform when heated.
• 【Precise Positioning】Tin mesh solder template is precisely positioned for fast tin implantation, and the ball template will not change under high temperature.
• 【Easy To Use】The stencil has a compact appearance and is easy to carry around and use.The BGA Rework Net is easy and quickly for reballing the BGA IC, useful and economical accessories for BGA soldering.

Details

The DIYPHONE Universal BGA Reballing Stencil Kit includes 19 stainless steel mesh stencils designed for Xiaomi series phone CPU and IC chip repair. The direct-heating templates support precise positioning for tin implantation, resist deformation during heating, and are compact for convenient handling during BGA reballing work.

UPC: 686585485441